Electrodeposition of aluminium and aluminium-copper alloys from a room temperature ionic liquid electrolyte containing aluminium chlo- ride and triethylamine hydrochloride

• Published in: 矿物冶金与材料学报：英文版 Vol. 20; no. 9; pp. 909 - 916
• Main Author: P. V. Suneesh T.G. Satheesh Babu T. Ramachandran
• Format: Journal Article
• Language: English
• Published: 2013
• Subjects: SEM-EDS; 三乙胺盐酸盐; 合金电沉积; 室温; 液体电解质; 离子; 铜合金; 铝铜
• ISSN: 1674-4799; 1869-103X

The electrodeposition of A1 and A1-Cu binary alloys on to gold substrates from a room temperature ionic liquid electrolyte containing A1C13-EtaNHC1 was studied. The electrochemical behavior of the electrolyte and the mechanism of deposition were investigated through cyclic voltammetry （CV）, and the properties of deposits obtained were assessed by scanning electron microscopy with energy dispersive X-ray spectroscopy （SEM-EDS） and X-ray diffraction （XRD）. A1 of 70μm in thickness and an A1-Cu alloy of 30μm in thickness with 8at% copper were deposited from the electrolyte. SEM images of the deposits indicate that the A1 deposit was smooth and uniform, whereas the Al-Cu deposit was nodular. The average crystalline size, as determined by XRD patterns, was found to be （30±5） and （29±5） nm, respectively, for A1 and A1-Cu alloys. Potentiodynamic polarization （Tafel plots） and electrochemical impedance spectroscopic （EIS） measurements showed that Al-Cu alloys are more corrosion resistant than Al.