Application of Electroless Fe-42Ni（P） Film for Under-bump Metallization on Solder Joint

Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diarnine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference...

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Published in材料科学技术学报：英文版 no. 1; pp. 7 - 12
Main Author Haifei Zhou Jingdong Guo Qingsheng Zhu Jianku Shang
Format Journal Article
LanguageEnglish
Published 2013
Subjects
Ni合金
凸点
应用化学
焊点
电影
界面反应
还原电位
金属化
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Summary:Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diarnine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2＋ and Fe2＋o The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
Bibliography:Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diarnine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2＋ and Fe2＋o The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
Under-bump metallization （UBM）; Electroless Fe--42Ni（P）; Sn; Solderability; Interfacial reaction
21-1315/TG
Haifei Zhou, Jingdong Guo, Qingsheng Zhu, Jianku Shang 1） Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang I 10016, China 2） Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
ISSN:1005-0302
1941-1162