电沉积Cu/液体微胶囊复合镀层的微观结构及沉积机理

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Bibliographic Details
Published in中国有色金属学报：英文版 Vol. 21; no. 10; pp. 2210 - 2215
Main Author 徐秀清 朱立群 李卫平 刘慧丛
Format Journal Article
LanguageEnglish
Published 2011
Subjects
电沉积机理
直流电沉积
纳米结构
铜/液体微胶囊复合镀层
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Bibliography:XU Xiu-qing,ZHU Li-qun,LI Wei-ping,LIU Hui-cong School of Materials Science and Engineering,Beihang University,Beijing 100191,China
43-1239/TG
copper/liquid microcapsule composite; DC electrodeposition; nanostructure; electrodeposition mechanism
The nanostructured copper/microcapsule containing liquid core materials composite（copper/liquid microcapsules composite） was prepared using direct current（DC） electrodeposition method.The surface morphology and microstructure of composite were investigated by means of scanning electron microscopy（SEM）,transmission electron microscopy（TEM） and X-ray diffraction（XRD）.The results show that the microstructure of electrodeposited layer transformed from bulk crystal to nano structure because of the participation of microcapsules.The diameters of microcapsules and the copper grain sizes in the composite were 2？20 μm and 10？20 nm,respectively.In addition,the electrodeposition mechanism of composite in the deposition process followed electrochemistry theory,which was proved by the theoretical analysis result and the experiment results.Meanwhile,the co-deposition process model was presented.
ISSN:1003-6326