Microstructure and electric properties of Sip/Al composites for electronic packaging applications

• Published in: Transactions of Nonferrous Metals Society of China Vol. 17; no. A02; pp. 1034 - 1038
• Main Author: 修子扬 武高辉 张强 宋美慧 田首夫
• Format: Journal Article
• Language: English
• Published: 2007
• Subjects: 导电性; 微观结构; 电子封装; 硅铝复合物
• ISSN: 1003-6326

Sip/1 199, Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure, panicle volume fraction, panicle size, matrix alloy and heat treatment on the electrical properties of composites were discussed, and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy, the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same panicle content, the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Panicle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results.