Antithrombogenic investigation and biological behavior of cultured human umbilical vein endothelial cells on Ti-O film

Our previous research results have shown that the Ti-O films with appropriate characteristics possess great potentials for biomaterials application. In this paper, using plasma immersion ion implantation and deposition (PIII-D), titanium oxide thin films are fabricated onto silicon wafer. The antith...

Full description

Saved in:
Bibliographic Details
Published inScience China. Technological sciences no. 1; pp. 20 - 28
Main Author CHEN Junying WAN Guojiang LENG Yongxiang YANG Ping SUN Hong WANG Jin HUANG Nan CHEN Huaiqing TANG Rong
Format Journal Article
LanguageEnglish
Published 2006
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Our previous research results have shown that the Ti-O films with appropriate characteristics possess great potentials for biomaterials application. In this paper, using plasma immersion ion implantation and deposition (PIII-D), titanium oxide thin films are fabricated onto silicon wafer. The antithrombogenesis of films is evaluated in vitro through the platelet adhesion investigation. The biological behavior of human umbilical vein endothelial cells (HUVEC) on the film surface is investigated in vitro by endothelial cell (EC) culture. Our results reveal that the crystalline Ti-O films exhibit attractive blood compatibility. The in vitro HUVEC-cultured investigation of Ti-O film surface has justified that the biological behavior of HUVECs on different structure surfaces is significantly different. The adherence, growth and proliferation of HUVECs to the crystalline Ti-O film surface are in order, by forming a perfect single layer, preserving the natural original shape and displaying the cobblestone road metal rank, and obviously superior to that on the amorphous Ti-O film surface. According to our study, the crystalline Ti-O film, with proper microstructure, is helpful for seeding Ecs and can be used as a functional surface for the adherence and growth of ECS.
Bibliography:TH
11-5845/TH
ISSN:1674-7321
1869-1900