A thermostable trilayer resist for niobium lift-off

We have developped a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature T_{g}= 235 C and an excellent chemical stability. The superconducting critical temperature of 1...

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Bibliographic Details
Main Authors Dubos, P, Charlat, P, Crozes, Th, Paniez, P, Pannetier, B
Format Journal Article
LanguageEnglish
Published 03.09.1999
Subjects
Physics - Materials Science
Physics - Mesoscale and Nanoscale Physics
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Summary:We have developped a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature T_{g}= 235 C and an excellent chemical stability. The superconducting critical temperature of 100 nm wide niobium lines is above 7 K. An example of shadow evaporation of a Nb-Cu submicron hybrid structure is given. A potential application of this process is the fabrication of very small single electron devices using refratory metals.
DOI:10.48550/arxiv.cond-mat/9909053