A Novel Low CTE, High Stiffness Ceramic Composite Core

Experimental results were corroborated with FEM modeling results. The high stiffness C-SiC boards with thinner BCB dielectrics did nol show failures related to dielectric cracking or solder joint fatigue. While finer via diameters could aggravate the microvia strains, a amibination of low CTE and hi...

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Bibliographic Details
Published inCircuits Assembly Vol. 18; no. 1; p. 28
Main Authors Kumbhat, Nitesh, Raj, P Markondeya, Pucha, Raghuram V, Sundaram, Venky
Format Trade Publication Article
LanguageEnglish
Published San Francisco Printed Circuit Engineering Association, Inc 01.01.2007
Subjects
Ceramics
Dielectric properties
Input output
Packaging
Substrates
Thermal cycling
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Summary:Experimental results were corroborated with FEM modeling results. The high stiffness C-SiC boards with thinner BCB dielectrics did nol show failures related to dielectric cracking or solder joint fatigue. While finer via diameters could aggravate the microvia strains, a amibination of low CTE and high-strength dielectrics can address the reliability problem in multilayered structures.
ISSN:1054-0407