Chemical Vapour Deposition of Si sub 3 N sub 4 From a Gas Mixture of Si sub 2 Cl sub 6 , NH sub 3 and H sub 2
Si sub 3 N sub 4 layers were obtained on a quartz substrate from a gas mixture of Si sub 2 Cl sub 6 , NH sub 3 and hydrogen under a reduced pressure in a temperature range of 800-1300 deg C. Amorphous Si sub 3 N sub 4 layers that were dense and adherent to the substrate were obtained in a temperatur...
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Published in | Journal of materials science Vol. 21; no. 11; pp. 3836 - 3842 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
01.11.1986
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Online Access | Get full text |
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Summary: | Si sub 3 N sub 4 layers were obtained on a quartz substrate from a gas mixture of Si sub 2 Cl sub 6 , NH sub 3 and hydrogen under a reduced pressure in a temperature range of 800-1300 deg C. Amorphous Si sub 3 N sub 4 layers that were dense and adherent to the substrate were obtained in a temperature range of 800-1100 deg C. On the other hand, alpha -Si sub 3 N sub 4 layers were obtained at 1200 deg C and a source-gas ratio (N/Si) of 1.33-1.77. The lowest deposition temperature of amorphous Si sub 3 N sub 4 was considered to be approx 700 deg C. The microhardness of amorphous Si sub 3 N sub 4 obtained in a temperature range of 800-1100 deg C was 2400-2600 kg mm exp --2 (load: 50 g), and that of alpha -Si sub 3 N sub 4 obtained at 1200 deg C was 3400 kg mm exp --2 . Chlorine contents in the Si sub 3 N sub 4 layer decreased wtih increasing deposition temperature and source-gas ratio (N/Si), and with decreasing total pressure. 31 ref.--AA |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0022-2461 |