MICRO-MACHINING WITH LASERS

Advanced laser technology is helping producers of microelectronic circuits meet the increasing need for higher quality in smaller packages. There are no shrinkage problems with laser machining, since the material is processed in its fired state. The locations of vias (holes) drilled by lasers have a...

Full description

Saved in:
Bibliographic Details
Published inCeramic Industry Vol. 152; no. 13; pp. 27 - 29
Main Author Coel, J
Format Magazine Article Trade Publication Article
LanguageEnglish
Published Troy BNP Media 01.12.2002
Subjects
Alumina
Circuits
Design
Design engineering
Dielectric properties
Drilling
Lasers
Metallurgy
Microelectronics
Motion picture directors & producers
Process engineering
Technology
United States > US
Online AccessGet full text

Cover

More Information
Summary:Advanced laser technology is helping producers of microelectronic circuits meet the increasing need for higher quality in smaller packages. There are no shrinkage problems with laser machining, since the material is processed in its fired state. The locations of vias (holes) drilled by lasers have a typical tolerance of +/- 0.001 in. if certain design rules and size limitations are met with the substrate. Some of the more common ceramic substrate materials that are laser machined include 96% Al2O3, 99% Al2O3, BeO2 and AlN. These materials offer circuit designers excellent dielectric properties with very good thermal stability and thermal conductivity. Some of the challenges to be overcome in laser machining are addressed, and future developments are considered. A case study of the use of laser micro-machining to create vias for plated and bonded copper (PBC) and copper plated thick film Al2O3 ceramic circuits for the microelectronics industry at CirQon Technologies Corp. is presented.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0009-0220
2328-4072