Growth of MnxAu1−x Films on Cu(001) and Ag(001) Single‐Crystal Substrates

The growth, morphology, and structure of MnxAu1−x$\left(\text{Mn}\right)_{x} \left(\text{Au}\right)_{1 - x}$ films on Cu(001) and Ag(001) are studied by means of low‐energy electron diffraction (LEED), medium‐energy electron diffraction, Auger electron spectroscopy, and scanning tunnelling microscop...

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Published inphysica status solidi (b) Vol. 261; no. 4
Main Authors Gelen, Ismet, Shinwari, Tauqir, Kumberg, Ivar, Hadjadj, Sebastien Elie, Shokr, Yasser A., Golias, Evangelos, Kuch, Wolfgang
Format Journal Article
LanguageEnglish
Published 01.04.2024
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Summary:The growth, morphology, and structure of MnxAu1−x$\left(\text{Mn}\right)_{x} \left(\text{Au}\right)_{1 - x}$ films on Cu(001) and Ag(001) are studied by means of low‐energy electron diffraction (LEED), medium‐energy electron diffraction, Auger electron spectroscopy, and scanning tunnelling microscopy. Different concentrations x from about 0.5 to 1 and thicknesses from 0.2 to 12.9 ML of MnxAu1−x$\left(\text{Mn}\right)_{x} \left(\text{Au}\right)_{1 - x}$ are examined. For several values of x, MnxAu1−x$\left(\text{Mn}\right)_{x} \left(\text{Au}\right)_{1 - x}$ exhibits a c(2 ×$\times$ 2) superstructure pattern on Cu(001) when the total thickness is around or above 0.5 ML. Above 1 ML, LEED patterns of MnxAu1−x$\left(\text{Mn}\right)_{x} \left(\text{Au}\right)_{1 - x}$ can be only observed on Ag(001), but not on Cu(001). LEED‐I(V) is employed to deduce the vertical interlayer distance for as‐grown and post‐annealed films on Ag(001). Above 500 K, Ag from the substrate segregates into the films. Antiferromagnetic films such as Mn2Au offer several advantages for application in future spinelectronic devices. In this article, the initial stages of growth of MnxAu1‐x for x ≳ 0.5 on Cu(001) and Ag(001) single‐crystal surfaces are studied by surface‐science techniques. On Ag(001), these films grow epitaxially layer by layer, while on Cu(001), only a single atomic monolayer shows epitaxial crystalline order.
ISSN:0370-1972
1521-3951
DOI:10.1002/pssb.202300518