3D HfO2 Thin Film MEMS Capacitor with Superior Energy Storage Properties
Capacitors are ubiquitous and crucial components in modern technologies. Future microelectronic devices require novel dielectric capacitors with higher energy storage density, higher efficiency, better frequency and temperature stabilities, and compatibility with integrated circuit (IC) processes. H...
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Published in | Advanced functional materials Vol. 33; no. 48 |
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Main Authors | , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Hoboken
Wiley Subscription Services, Inc
23.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | Capacitors are ubiquitous and crucial components in modern technologies. Future microelectronic devices require novel dielectric capacitors with higher energy storage density, higher efficiency, better frequency and temperature stabilities, and compatibility with integrated circuit (IC) processes. Here, in order to overcome these challenges, a novel 3D HfO2 thin film capacitor is designed and fabricated by an integrated microelectromechanical system (MEMS) process. The energy storage density (ESD) of the capacitor reaches 28.94 J cm−3, and the energy storage efficiency of the capacitor is up to 91.3% under an applied electric field of 3.5 MV cm−1. The ESD can be further improved by reducing the minimum period structure size of the 3D capacitor. Moreover, the 3D capacitor exhibits excellent temperature stability (up to 150 °C) and charge‐discharge endurance (107 cycles). The results indicate that the 3D HfO2 thin film MEMS capacitor has enormous potential in energy storage applications in harsh environments, such as pulsed discharge and power conditioning electronics.
Microelectronic devices consisiting of novel 3D dielectric MEMS capacitors are successfully fabricated by stander IC processes, which have higher energy storage density, higher storage efficiency, better frequency and temperature stabilities. Additionally, the capacitor exhibits excellent reliability of Wre and η even after 107 charge‐discharge cycles at room temperature. |
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ISSN: | 1616-301X 1616-3028 |
DOI: | 10.1002/adfm.202305733 |