Improved mechanical performance and unique toughening mechanisms of UDM processed epoxy‐SiO2 nanocomposites

• Published in: Polymer composites Vol. 42; no. 11; pp. 6000 - 6009
• Main Authors: Kumar, Kaushal, Goyat, Manjeet S., Solanki, Ankur, Kumar, Arun, Kant, Ravi, Ghosh, Prakriti K.
• Format: Journal Article
• Language: English
• Published: Hoboken, USA John Wiley & Sons, Inc 01.11.2021; Blackwell Publishing Ltd
• Subjects: Bonding strength; Crack propagation; epoxy; fracture analysis; Fracture surfaces; Fracture toughness; Interfacial bonding; Mechanical properties; nanocomposite; Nanocomposites; Nanoparticles; nano‐SiO2; Performance evaluation; Plastic deformation; Silicon dioxide; Surface analysis (chemical); Tensile strength
• ISSN: 0272-8397; 1548-0569
• DOI: 10.1002/pc.26280

This work demonstrates improved mechanical performance and unique toughening mechanisms of ultrasonic dual mixing (UDM) processed epoxy‐SiO2 nanocomposites. The loading of SiO2 nanoparticles in the epoxy matrix was varied from 1 to 5 vol% to produce the nanocomposites. The mechanical performance was evaluated by measuring the tensile and fracture properties of the nanocomposites. An optimal nanoparticle loading of 3 vol% in epoxy was found vital for improved performance of the nanocomposite. The optimal nanoparticle loading in epoxy lead to an increase of 18.45% in tensile strength and 120% increase in fracture toughness (GIC) compared to the neat epoxy. The fracture surface analysis revealed various toughening mechanisms including particle pull out, plastic void growth, plastic deformation, and crack deflection along with a unique mechanism of strong interfacial bonding between SiO2 particle and epoxy matrix. SiO2 nanoparticles (1‐5 vol.%) were dispersed effectively in epoxy matrix using UDM. Mechanical performance of optimized epoxy‐SiO2 nanocomposites improved significantly. The fracture surface of nanocomposites revealed various unique toughening mechanisms.