Future challenges in computational lithography
To the degree that the modeling is inaccurate, the edges on the wafer will end up in the wrong locations. Lithographers tell us that optical proximity correction (OPC) errors and mask errors are their two largest error sources. OPC errors, however, have two components: modeling error and numerical e...
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| Published in | Solid state technology Vol. 49; no. 5; p. 68 |
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| Main Author | |
| Format | Magazine Article |
| Language | English |
| Published |
Tulsa
PennWell Corporation
01.05.2006
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| Subjects | |
| Online Access | Get full text |
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| Abstract | To the degree that the modeling is inaccurate, the edges on the wafer will end up in the wrong locations. Lithographers tell us that optical proximity correction (OPC) errors and mask errors are their two largest error sources. OPC errors, however, have two components: modeling error and numerical error associated with prescribing the OPC. |
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| AbstractList | To the degree that the modeling is inaccurate, the edges on the wafer will end up in the wrong locations. Lithographers tell us that optical proximity correction (OPC) errors and mask errors are their two largest error sources. OPC errors, however, have two components: modeling error and numerical error associated with prescribing the OPC. |
| Author | Wiley, Jim |
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| Title | Future challenges in computational lithography |
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