Future challenges in computational lithography

To the degree that the modeling is inaccurate, the edges on the wafer will end up in the wrong locations. Lithographers tell us that optical proximity correction (OPC) errors and mask errors are their two largest error sources. OPC errors, however, have two components: modeling error and numerical e...

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Bibliographic Details
Published inSolid state technology Vol. 49; no. 5; p. 68
Main Author Wiley, Jim
Format Magazine Article
LanguageEnglish
Published Tulsa PennWell Corporation 01.05.2006
Subjects
Computer based modeling
Errors
Integrated circuits
Manufacturing
Offset printing
Product design
Semiconductors
United States > US
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Summary:To the degree that the modeling is inaccurate, the edges on the wafer will end up in the wrong locations. Lithographers tell us that optical proximity correction (OPC) errors and mask errors are their two largest error sources. OPC errors, however, have two components: modeling error and numerical error associated with prescribing the OPC.
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ISSN:0038-111X