Tin Pest in Tin-rich Solders

Tin is a common component of solders because of its desirable properties such as low melting point, high diffusivity, low surface tension in the liquid phase, and others. It also possesses undesirable habits that are a concern for flip chip and wafer-level chip-scale packages (WLCSP), such as tin wh...

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Bibliographic Details
Published inAdvanced packaging Vol. 15; no. 9; pp. 32 - 34
Main Author Rinne, Glenn A
Format Magazine Article
LanguageEnglish
Published Tulsa PennWell Corporation 01.11.2006
Subjects
Grain growth
Immunization
Soldering
Surface tension
Temperature
Tin
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Summary:Tin is a common component of solders because of its desirable properties such as low melting point, high diffusivity, low surface tension in the liquid phase, and others. It also possesses undesirable habits that are a concern for flip chip and wafer-level chip-scale packages (WLCSP), such as tin whisker growth, electromigration, and tin pest. The first two of these have been well discussed, but tin pest is a little-known and potentially regrettable habit of pure-tin and tin-rich materials. As the industry moves to nearly pure-tin lead-free solders, it should be aware of tin pest, an allotropic transformation that causes tin objects to deteriorate at low temperatures. Although tin pest has not been reported in solder joints, it is important to understand what conditions might lead to a problem.
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ISSN:1065-0555