Computational simulation and experimental analysis of the mold-filling process in μPIM

• Published in: Journal of micromechanics and microengineering Vol. 21; no. 4
• Main Authors: HAIQING YIN, QING WANG, XUANHUI QU, CHENGCHANG JIA, JOHNSON, John L
• Format: Journal Article
• Language: English
• Published: Bristol Institute of Physics 01.04.2011
• Subjects: Applied sciences; Cross-disciplinary physics: materials science; rheology; Electronics; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Materials science; Materials synthesis; materials processing; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices and systems; Physics; Precision engineering, watch making; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Thermoplastics; Solid inclusion; Thermomechanical properties; Experimental study; Binders; Gears; Powder technology; Morphology; Injection molding; Modelling; Filling; Large scale; Thermoplasticity; Mold; Carbonyls
• ISSN: 0960-1317; 1361-6439
• DOI: 10.1088/0960-1317/21/4/045023