Optimization of a low damage, high resolution etch process for SiNx in an ECR reactor

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 143; no. 1; pp. 288 - 292
Main Authors OLSON, R. J, KAZIOR, T. E, LANE, B, HOLBER, W. M, BOURGET, L
Format Journal Article
LanguageEnglish
Published Pennington, NJ Electrochemical Society 1996
Subjects
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Microelectronic fabrication
Patterning
Failure analysis
Plasma etching
Silicon Nitrides
Semiconductor substrate
Electron cyclotron resonance
Chemical etching
III-V compound
Optimization
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ISSN:0013-4651
1945-7111
DOI:10.1149/1.1836424