Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

In comparison to Sn-Pb solders, a successful Sn-Ag-Cu alloy solder should exhibit enhanced shear strength at ambient temperatures.

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Bibliographic Details
Published inJOM (1989) Vol. 54; no. 6; pp. 26 - 29
Main Authors Anderson, I E, Cook, B A, Harringa, J L, Terpstra, R L
Format Journal Article
LanguageEnglish
Published New York Springer Nature B.V 01.06.2002
Subjects
Alloys
Cobalt
Cooling
Copper
Electronics
Laboratories
Microstructure
R&D
Research & development
Scanning electron microscopy
Shear strength
Shear tests
Soldering
Solidification
Standard deviation
Temperature
Tin
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Summary:In comparison to Sn-Pb solders, a successful Sn-Ag-Cu alloy solder should exhibit enhanced shear strength at ambient temperatures.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
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ISSN:1047-4838
DOI:10.1007/BF02701845