Flash Memory for Stacked PoP Technology
While the selection of flux or paste used during final PoP assembly also contributed to a better joint formation, counter- ing the gap left due to package war- page, the addition of higher melting point metal flakes in the paste used facilitates bridging and filling of the gap left behind during ref...
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Published in | Advanced packaging Vol. 17; no. 4; p. 20 |
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Main Authors | , , , |
Format | Magazine Article |
Language | English |
Published |
Tulsa
PennWell Corporation
01.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | While the selection of flux or paste used during final PoP assembly also contributed to a better joint formation, counter- ing the gap left due to package war- page, the addition of higher melting point metal flakes in the paste used facilitates bridging and filling of the gap left behind during reflow. |
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Bibliography: | content type line 24 ObjectType-Feature-1 SourceType-Magazines-1 ObjectType-Article-2 SourceType-Scholarly Journals-1 content type line 23 |
ISSN: | 1065-0555 |