Flash Memory for Stacked PoP Technology

While the selection of flux or paste used during final PoP assembly also contributed to a better joint formation, counter- ing the gap left due to package war- page, the addition of higher melting point metal flakes in the paste used facilitates bridging and filling of the gap left behind during ref...

Full description

Saved in:
Bibliographic Details
Published inAdvanced packaging Vol. 17; no. 4; p. 20
Main Authors Seah, Kenneth, Wong, Bertrand, Heng, Goh Swee, Leng, Tan Choon
Format Magazine Article
LanguageEnglish
Published Tulsa PennWell Corporation 01.05.2008
Subjects
Cost structure
Demand
Electronics industry
Engineering
Flexibility
Handheld computers
Manufacturers
Packaging
Residual stress
Semiconductors
Test systems
Online AccessGet full text

Cover

More Information
Summary:While the selection of flux or paste used during final PoP assembly also contributed to a better joint formation, counter- ing the gap left due to package war- page, the addition of higher melting point metal flakes in the paste used facilitates bridging and filling of the gap left behind during reflow.
Bibliography:content type line 24
ObjectType-Feature-1
SourceType-Magazines-1
ObjectType-Article-2
SourceType-Scholarly Journals-1
content type line 23
ISSN:1065-0555