Selected papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07)

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Bibliographic Details
Published inSoldering & surface mount technology Vol. 21; no. 2
Main Authors LIU, Johan, DAOQIANG LU, ANDERSSON, Cristina
Format Conference Proceeding
LanguageEnglish
Published Bradford Emerald 2009
Subjects
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Circuit design
Micromachine
High density
Electronic packaging
Integrated circuit
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ISSN:0954-0911
1758-6836