Polymer self assembly in semiconductor microelectronics

• Published in: IBM journal of research and development Vol. 51; no. 5; p. 605
• Main Authors: Black, C T, Ruiz, R, Breyta, G, Cheng, J Y
• Format: Journal Article
• Language: English
• Published: Armonk International Business Machines Corporation 01.09.2007
• Subjects: Microelectronics; Microprocessors; Polymers; Polymethyl methacrylate; Semiconductors
• ISSN: 0018-8646; 2151-8556
• DOI: 10.1147/rd.515.0605

We are inspired by the beauty and simplicity of self-organizing materials and the promise they hold for enabling continued improvements in semiconductor technology. Self assembly is the spontaneous arrangement of individual elements into regular patterns; under suitable conditions, certain materials self organize into useful nanometer-scale patterns of importance to high-performance microelectronics applications. Polymer self assembly is a nontraditional approach to patterning integrated circuit elements at dimensions and densities inaccessible to traditional lithography methods. We review here our efforts in IBM to develop and integrate self-assembly processes as high-resolution patterning alternatives and to demonstrate targeted applications in semiconductor device fabrication. We also provide a framework for understanding key requirements for the adoption of polymer self-assembly processes into semiconductor technology, as well as a discussion of the ultimate dimensional scalability of the technique. [PUBLICATION ABSTRACT]