Dynamic Behavior of Materials

• Format: eBook
• Language: English
• Published: Basel MDPI - Multidisciplinary Digital Publishing Institute 2023
• Subjects: 12.7 mm API projectile; austenitization; ballistic performance; bend space; ceramic composite armor; cold hearth; damage evolutionary behavior; deflagration reaction; deflection and yaw; deformation twin; deployment phase; dynamic deformation; dynamic model; dynamic modeling; dynamic response; explosively formed projectile; fine grain strengthening; fine-grained D6A steel; finite element simulation; flow field; formation; fracture mechanics; high-pressure EOS; honeycomb; Hugoniot parameters; ignition behavior; impact; impact-induced deflagration; inclusions; Johnson-Cook constitutive model; Johnson–Cook equation; Johnson–Kendall–Robert model; kinetic projectile; liner material; Mathematics and Science; microstructure; modeling; moisture content; movement; multi-diameter tungsten fiber-reinforced Zr-based bulk metallic glasses matrix composite; multi-layer aluminum target; multi-layer plates; n/a; near-α titanium alloy; NM500/Q345 clad plate; numerical simulation; parachute recovery; parameter analysis; penetration failure mode; Physics; polyurethane setae array; properties; PTFE/Al; reaction ratio; reactive material; reactive materials; reactive materials projectile; reactive shaped charge jet; Reference, Information and Interdisciplinary subjects; Research and information: general; shaped charge jet; simulation; strain rate sensitivity; surface energy; temperature distribution; trans-scale discretization; tungsten fiber; tungsten heavy alloy; ultimate bending diameter; unmanned aerial vehicle; unsaturated clay; weaved composite material
• ISBN: 9783036569420; 3036569421; 303656943X; 9783036569437
• DOI: 10.3390/books978-3-0365-6943-7

This Special Issue on the “Dynamic Behavior of Materials” collected recent research findings on the dynamic behavior of various materials. A collection of fifteen peer-reviewed research articles were included in this Special Issue. The main topics covered include processing technology, state-of-the-art characterization, testing, theoretic modeling, and simulation. We hope that this Special Issue will be interesting for the academic community, and also hope that it will shed light on future research activities in this field.