Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degree C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing densi...

Full description

Saved in:
Bibliographic Details
Published inRSC advances Vol. 6; no. 15; pp. 12048 - 12052
Main Authors Yonezawa, Tetsu, Tsukamoto, Hiroki, Yong, Yingqiong, Nguyen, Mai Thanh, Matsubara, Masaki
Format Journal Article
LanguageEnglish
Published 01.01.2016
Subjects
Copper
Electrical resistivity
Electronics
Gas flow
Metalorganic compounds
Nitrogen
Sintering
Strategy
Online AccessGet full text

Cover

More Information
Summary:A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degree C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 10-6 Omega m). This novel process may open a new strategy in the field of printed electronics.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:2046-2069
DOI:10.1039/c5ra25058g