Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation
A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degree C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing densi...
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Published in | RSC advances Vol. 6; no. 15; pp. 12048 - 12052 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
01.01.2016
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Subjects | |
Online Access | Get full text |
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Summary: | A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 degree C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 10-6 Omega m). This novel process may open a new strategy in the field of printed electronics. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 2046-2069 |
DOI: | 10.1039/c5ra25058g |