건습식 혼합공정을 이용한 유연소재 상 전자파 차폐용 다층막 코팅

• Published in: Biuletyn Uniejowski Vol. 50; no. 5; pp. 373 - 379
• Main Authors: 이훈성(Hoon-Seung Lee), 이명훈(Myeong-Hoon Lee)
• Format: Journal Article
• Language: Korean
• Published: 한국표면공학회 2017
• Subjects: 기계공학; Flexible substrate; Electrodeposition; Electromagnetic wave shielding; Mixing process; Electroless plating; Ultra-thin multilayers
• ISSN: 1225-8024; 2299-8403; 2288-8403
• DOI: 10.5695/JKISE.2017.50.5.373

Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared $2{\mu}m$ Zn/Cu/Ni multilayers coated on $12{\mu}m$ polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around $0.2{\Omega}$ by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.