전류밀도에 따른 SnAg 도금층의 특성 및 Cu 필라 솔더 범프의 단면 미세구조 측정

• Published in: Biuletyn Uniejowski Vol. 48; no. 4; pp. 131 - 135
• Main Authors: 김상혁(Sang-Hyuk Kim), 홍성기(Seong-Ki Hong), 임현호(Hyunho Yim), 이효종(Hyo-Jong Lee)
• Format: Journal Article
• Language: Korean
• Published: 한국표면공학회 2015
• Subjects: 기계공학; Electroplating; Microstructure; Current density; SnAg; EBSD
• ISSN: 1225-8024; 2299-8403; 2288-8403
• DOI: 10.5695/JKISE.2015.48.4.131

We investigated the surface morphology and the change of Ag concentration for SnAg electrodeposits according to the current density using labmade and commercial plating solutions. The concentration of Ag in the SnAg electrodeposits decreased with increasing the current density. The Ag concentrations at the conditions of over $50mA/cm^2$ were below 3 wt% and the surface was relatively smooth. Cu pillar bump was fabricated by using SnAg electroplating, and it was reflowed at $240^{\circ}C$ for 90 sec. The cross-sectional microstructure was investigated by using EBSD measurement and it was found that the grain size of SnAg became smaller by increasing the number of reflow treatments.