복사에너지를 이용한 TIM소재의 방열 특성 향상을 위한 연구

• Published in: Biuletyn Uniejowski Vol. 52; no. 2; pp. 58 - 61
• Main Authors: 황명원(Myungwon Hwang), 김도형(Dohyung Kim), 정우창(Uoo-Chang Jung), 정원섭(Wonsub Chung)
• Format: Journal Article
• Language: Korean
• Published: 한국표면공학회 2019
• Subjects: 기계공학; Thermal bypass; Thermal conductivity; Emissivity; Thermal resistance; Thermal Interface Material (TIM)
• ISSN: 1225-8024; 2299-8403; 2288-8403
• DOI: 10.5695/JKISE.2019.52.2.58

The aim of this study is to quantitatively demonstrate the possibility of heat transfer by thermal radiation by comparing heat transfer by conventional heat transfer and radiation by radiation. 1) The heat transfer was measured by using filler of TIM material with low thermal conductivity (CuS). As a result, heat transfer was easier than ceramic with high thermal conductivity ($Al_2O_3$ and $Si_3N_4$). 2) The reason for this is thought to be that the infrared wave due to radiation of the air diaphragm has moved easily. 3) From the above results, the heat dissipation of the TIM material indicates the possibility of heat transfer by thermal radiation.