접착 필름과 평판 유리를 이용하여 봉지된 유기 발광 소자의 발광 특성

To study the encapsulation method for large-area organic light emitting devices (OLEDs), OLED of ITO / 2-TNATA / NPB / $Alq_3$:Rubrene / $Alq_3$ / LiF / Al structure was fabricated, which on $Alq_3$/LiF/Al as protective layer of OLED was deposited to protect the damage of OLED, and subsequently it w...

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Bibliographic Details
Published inBiuletyn Uniejowski Vol. 46; no. 3; pp. 111 - 115
Main Authors 임수용(Su Yong Lim), 양재웅(Jae-Woong Yang), 주성후(Sung-Hoo Ju)
Format Journal Article
LanguageKorean
Published 한국표면공학회 2013
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Summary:To study the encapsulation method for large-area organic light emitting devices (OLEDs), OLED of ITO / 2-TNATA / NPB / $Alq_3$:Rubrene / $Alq_3$ / LiF / Al structure was fabricated, which on $Alq_3$/LiF/Al as protective layer of OLED was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and flat glass. The current density and luminance of encapsulated OLED using attaching film and flat glass has similar characteristics compared with non-encapsulated OLED when thickness of Al as a protective layer was 1200 nm, otherwise power efficiency of encapsulated OLED was better than non-encapsulated OLED. Encapsulation process using attaching film and flat glass did not have any effects on the emission spectrum and the Commission International de L'Eclairage (CIE) coordinate. The lifetime of encapsulated OLED using attaching film and flat glass was 287 hours in 1200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 54% compared with 186 hours in same Al thickness, lifetime of encapsulated OLED using epoxy and flat glass. As a result, it showed the improved efficiency and the long lifetime, because the encapsulation method using attaching film and flat glass could minimize the impact on OLED caused through UV hardening process in case of glass encapsulation using epoxy.
Bibliography:KISTI1.1003/JNL.JAKO201319947249810
G704-000261.2013.46.3.006
http://ocean.kisti.re.kr/IS_mvpopo001P.do?method=multMain&poid=kise
ISSN:1225-8024
2299-8403
2288-8403
DOI:10.5695/JKISE.2013.46.3.111