Planarization Techniques

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Bibliographic Details
Published inHandbook of Multilevel Metallization for Integrated Circuits p. 1
Main Authors Tracy, Clarence J, Wilson, Syd R, Freeman Jr., John L
Format Book Chapter
LanguageEnglish
Published United States William Andrew Publishing/Noyes 1993
Elsevier Science & Technology Books
Subjects
Electronics & Semiconductors
Manufacture & Processing
Online AccessGet full text

Cover

Table of Contents:
  • 1.0 Why Planarize? 2.0 Concepts 3.0 Thermal Flow of Borophosphosilicate Glass (BPSG Films) 4.0 Planarization with Sacrificial Photoresist 5.0 Planarization Using Spin-On-Glass 6.0 Deposition-Etchback Techniques 7.0 Planarization by Chemical-Mechanical Polishing 8.0 Gap Filling Using CVD Ozone-TEOS Oxides 9.0 Outlook References