등숙기 고온이 국내 밀 품종의 밀가루 및 가공적성에 미치는 영향
The flour physiochemical properties and end-use quality of wheat were evaluated to identify the effect of high temperature (HT) during grain maturation. HT caused a decrease in the width and thickness of grains. However, HT did not affect the grain weight, volume, length, test weight and 1,000-kerne...
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Published in | Korean journal of breeding Vol. 51; no. 1; pp. 20 - 33 |
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Main Authors | , , , , , , , , , , |
Format | Journal Article |
Language | Korean |
Published |
한국육종학회
01.03.2019
The Korean Breeding Society |
Subjects | |
Online Access | Get full text |
ISSN | 0250-3360 2287-5174 |
DOI | 10.9787/KJBS.2019.51.1.20 |
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Summary: | The flour physiochemical properties and end-use quality of wheat were evaluated to identify the effect of high temperature (HT) during grain maturation. HT caused a decrease in the width and thickness of grains. However, HT did not affect the grain weight, volume, length, test weight and 1,000-kernel weight in Korean wheat cultivars. Although HT marginally affected the general flour physiochemical properties and gluten composition, the effects were not significant. Based on the results of the evaluation of end-use quality, the effect of HT on the end-use quality was not significant. Nevertheless, the allelic composition was related to the quantity and quality of grain under HT conditions. In Korean wheat cultivars containing Glu-D1d and -D1f alleles, the 1,000-kernel weight was decreased by HT. In addition, Glu-D1f was more sensitive to HT than was Glu-D1d. The proportion of the y-type high-molecular-weight glutenin subunits (HMW-GSs) was decreased by HT in Korean wheat cultivars containing the Glu-A1ab allele, and was increased in cultivars containing the Glu-B3d allele. Furthermore, the proportions of gliadin and low-molecular-weight glutenin subunits (LMW-GSs) were decreased by HT in Korean wheat cultivars containing Glu-A1ab or Glu-B3ahi alleles. KCI Citation Count: 2 |
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Bibliography: | https://doi.org/10.9787/KJBS.2019.51.1.20 |
ISSN: | 0250-3360 2287-5174 |
DOI: | 10.9787/KJBS.2019.51.1.20 |