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분자 동역학 계산을 통한 결정질 실리콘 태양전지 기판에 콜드 스프레이 전극 형성 시 발생되는 비정질 구리상에 대한 용융 온도 변화 연구
In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between...
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Published in | Current Photovoltaic Research Vol. 3; no. 2; pp. 61 - 64 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | Korean |
Published |
한국태양광발전학회
2015
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Subjects | |
Online Access | Get full text |
ISSN | 2288-3274 2508-125X |
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Summary: | In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature. |
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Bibliography: | KISTI1.1003/JNL.JAKO201511639882992 |
ISSN: | 2288-3274 2508-125X |