분자 동역학 계산을 통한 결정질 실리콘 태양전지 기판에 콜드 스프레이 전극 형성 시 발생되는 비정질 구리상에 대한 용융 온도 변화 연구

In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between...

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Published inCurrent Photovoltaic Research Vol. 3; no. 2; pp. 61 - 64
Main Authors 김수민(Soo Min Kim), 강병준(Byungjun Kang), 정수정(Sujeong Jeong), 강윤묵(Yoonmook Kang), 이해석(Hae-seok Lee), 김동환(Donghwan Kim)
Format Journal Article
LanguageKorean
Published 한국태양광발전학회 2015
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ISSN2288-3274
2508-125X

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Summary:In solar industry, numerous researchers reported about cold spray method among various electrode formation technic, but there are no known a bonding mechanism of metal powder. In this study, a cross-section of copper electrode formed by cold spray method was observed and heterogeneous phase between silicon substrate and copper electrode was analyzed using morphology observation technic. SEM and TEM analysis were performed to analyze a crystallinity and distribution shape of heterogeneous copper phase. Molecular dynamics simulation was performed to calculate glass transition temperature of copper metal. In the result, amorphous copper phase was observed near interface between silicon substrate and metal electrode. The results of the molecular dynamics simulation show that an amorphous copper phase could be formed at a temperature below the melting point of copper because cold spraying resulted in a lower glass transition temperature.
Bibliography:KISTI1.1003/JNL.JAKO201511639882992
ISSN:2288-3274
2508-125X