Novel Bumping Material for Solder-on-Pad Technology

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for...

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Bibliographic Details
Published inETRI journal Vol. 33; no. 4; pp. 637 - 640
Main Authors Choi, Kwang-Seong, Chu, Sun-Woo, Lee, Jong-Jin, Sung, Ki-Jun, Bae, Hyun-Cheol, Lim, Byeong-Ok, Moon, Jong-Tae, Eom, Yong-Sung
Format Journal Article
LanguageKorean
Published 한국전자통신연구원 30.08.2011
ETRI
Subjects
Sn3Ag0.5Cu solder
resin
Maskless bumping
solder-on-pad (SoP) technology
5Cu solder
Sn3Ag0
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Summary:A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.
Bibliography:KISTI1.1003/JNL.JAKO201171242950269
ISSN:1225-6463
2233-7326