전자부품 커넥터의 접속 신뢰성 향상을 위한 Au-Sn 합금 도금층 연구

• Published in: Biuletyn Uniejowski Vol. 55; no. 6; pp. 408 - 416
• Main Authors: 최종환(Jong Hwan Choi), 손인준(Injoon Son)
• Format: Journal Article
• Language: Korean
• Published: 한국표면공학회 2022
• Subjects: Au-Sn alloy plating; Contact resistance; Connection reliability; Thermal aging; Au alloy plating
• ISSN: 1225-8024; 2299-8403

In this study, the effect of Au-Sn alloy coating on reliability of electrical contacts was investigated via comparison with Au-Co alloy coating. The results show that Au-Sn alloy exhibited lower contact resistance and higher solder spreadability than those of Au-Co alloy after thermal aging. In the case of Au-Co alloy plating, the underlying Ni element diffused into Au-Co layer to form Ni oxides on surface during thermal aging, leading to increased contact resistance and decreased solder spreadability. Meanwhile, for Au-Sn alloy plating, Au-Ni-Sn metallic compound was formed at the interface between Au-Sn layer and underlying Ni layer. This compound acted as a diffusion barrier, thereby inhibiting the diffusion of Ni to Au-Sn layer during thermal aging. Consequently, Au-Sn alloy layer showed better contact reliability than that of Au-Co alloy layer.