Novel Maskless Bumping for 3D Integration

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on...

Full description

Saved in:
Bibliographic Details
Published inETRI journal Vol. 32; no. 2; pp. 342 - 344
Main Authors Choi, Kwang-Seong, Sung, Ki-Jun, Lim, Byeong-Ok, Bae, Hyun-Cheol, Jung, Sung-Hae, Moon, Jong-Tae, Eom, Yong-Sung
Format Journal Article
LanguageKorean
Published 한국전자통신연구원 30.04.2010
ETRI
Subjects
Maskless bumping
low-melting-point solder
solder bump maker (SBM)
Online AccessGet full text

Cover

More Information
Summary:A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.
Bibliography:KISTI1.1003/JNL.JAKO201071242949177
ISSN:1225-6463
2233-7326