압연 클래드된 Ti/Mild steel/Ti 재의 계면확산층과 접합력에 미치는 후열처리온도의 영향

• Published in: 대한금속·재료학회지, 50(4) Vol. 50; no. 4; pp. 316 - 323
• Main Authors: 이상목, Sang Mok Lee, 김수민, Su Min Kim, 위세나, Se Na We, 배동현, Dong Hyun Bae, 이근안, Geun An Lee, 이종섭, Jong Sup Lee, 김용배, Yong Bae Kim, 배동수, Dong Su Bae
• Format: Journal Article
• Language: Korean
• Published: 대한금속재료학회 20.04.2012; 대한금속·재료학회
• Subjects: bonding force; bonding interface property; diffusion Layer; intermetallic compound; post heat treatment; Ti/Mild steel/Ti clad material; 재료공학
• ISSN: 1738-8228; 2288-8241
• DOI: 10.3365/KJMM.2012.50.4.316

The aim of this study is to investigate the effect of post heat treatment on bonding properties of roll cladded Ti/MS/Ti materials. First grade Ti sheets and SPCC mild steel sheets were prepared and then Ti/MS/Ti clad materials were fabricated by a cold rolling and post heat treatment process. Microstructure and point analysis of the Ti/MS interfaces were performed using the SEM and EDX Analyser. Diffusion bonding was observed at the interfaces of Ti/MS. The thickness of the diffusion layer increased with post heat treatment temperature and the diffusion layer was verified as having (ε+ζ)+(ζ+β-Ti) intermetallic compounds at 700℃ and an (ζ+β-Ti) intermetallic compound at 800℃, respectively. The micro Knoop hardness of mild steel decreased with post heat treatment temperature; however, those of Ti decreased at a range of 500~600 ℃ and showed a uniform value until 800℃ and then increased rapidly up to 900℃. The micro Knoop hardness value of the diffusion layer increased up to 700℃ and then saturated with post heat treatment. A T-type peel test was used to estimate the bonding forces of Ti/Mild steel interfaces. The bonding forces decreased up to 800℃ and then increased slightly with post heat treatment. The optimized temperature ranges for post heat treatment were 500~600℃ to obtain the proper formability for an additional plastic deformation process.