LTCC용 복합체의 열적 특성 및 유전 특성에 AlN 충전제의 함량이 미치는 영향

• Published in: 대한금속·재료학회지, 52(12) Vol. 52; no. 12; pp. 1037 - 1043
• Main Authors: 김일구, Il Gu Kim, 김종환, Jong Hwan Kim, 정재엽, Jae Yeop Jung, 최수연, Su Yeon Choi, 박현준, Hyun Jun Park, 류봉기, Bong Ki Ryu
• Format: Journal Article
• Language: Korean
• Published: 대한금속재료학회 31.12.2014; 대한금속·재료학회
• Subjects: composites; LTCC; sintering; thermal analysis; thermal conductivity; 재료공학
• ISSN: 1738-8228; 2288-8241
• DOI: 10.3365/KJMM.2014.52.12.1037

For LTCC substrate applications, glass-ceramic composites were produced with different glass- ceramic filler ratios. To maximize the signal speed, the composites were required to have a low dielectric constant and high thermal conductivity. To improve these properties, one approach is to add ceramic fillers with high thermal conductivity and electrical resistance to the glass matrix. We selected AlN filler due to its suitable thermal and electrical properties. With higher contents of AlN filler, the thermal conductivity of the composites increased. The increase in the thermal conductivity of the composites is attributed to the high thermal conductivity of AlN, due to which the heat dissipation network of the composite is enhanced. However, when the AlN filler content was more than 20 wt%, the thermal conductivity of the composites decreased due to the pore formation. The 20 wt% AlN sample showed the highest thermal conductivity and a relatively low dielectric constant.