Terahertz Technology and Its Applications

• Format: eBook
• Language: English
• Published: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
• Subjects: adaptive range gates; anti-series; bias; cascaded doubler; catadioptric horn-like lens; CMOS; CMOS process; conversion loss; correction; electric field; flip-chip; foreign materials; high output power; hollowing; honeycomb sandwiches; hybrid integrated circuit; image distortion; InGaAs; light field imaging; molecular beam epitaxy; n/a; open stone relics; optical delay line; optical encoder; oscillator; periodic waveguides; photoconductive antenna; preservation of cultural heritage; quadrupler; radar cross-section; rectangular inset-feed patch antenna; Reference, Information and Interdisciplinary subjects; reflection phases; Research and information: general; resolving power; resonances; rubber; Schottky diode; Schottky Diode Detectors; Schottky varactor; signal-to-noise ratio; silica dispersion; sub-harmonic mixer; synthetic aperture imaging; terahertz imaging; terahertz metrology; Terahertz radar; terahertz spectra; terahertz spectroscopy; terahertz wave generation; terahertz waves; THz; THz detector; THz-TDS; time-domain spectroscopy; time-of-flight; topological properties; vulcanization; W band; weathered; wire bonding; ZBD modeling
• ISBN: 9783036509969; 3036509976; 9783036509976; 3036509968
• DOI: 10.3390/books978-3-0365-0997-6

The Terahertz frequency range (0.1 – 10)THz has demonstrated to provide many opportunities in prominent research fields such as high-speed communications, biomedicine, sensing, and imaging. This spectral range, lying between electronics and photonics, has been historically known as “terahertz gap” because of the lack of experimental as well as fabrication technologies. However, many efforts are now being carried out worldwide in order improve technology working at this frequency range. This book represents a mechanism to highlight some of the work being done within this range of the electromagnetic spectrum. The topics covered include non-destructive testing, teraherz imaging and sensing, among others.