摩耗率の異なる材料を利用した形状発現型ポリシングパッドの開発

We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad...

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Bibliographic Details
Published inJournal of the Japan Society for Abrasive Technology Vol. 62; no. 5; pp. 264 - 266
Main Authors ONIKI Takahiro, 加藤 侑也, KHAJORNRUNGRUANG Panart, 鈴木 恵友, 田代 康典, 松尾 正昭
Format Journal Article
LanguageJapanese
Published 社団法人 砥粒加工学会 01.05.2018
The Japan Society for Abrasive Technology
Subjects
CMP
hard to process materials
pad material
pad surface
polishing pad
sapphire substrate
wear rate
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ISSN0914-2703
1880-7534
DOI10.11420/jsat.62.264

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Summary:We have developed a polishing pad using materials with different wear rates to achieve highly efficient polishing of difficult-to-process material substrates. Nylon fibers with good mechanical properties are arranged with other materials, followed by dressing to form protrusions on the polishing pad surface. Stable polishing performance can be expected if the orientation and arrangement of the nylon fibers can be controlled. A sapphire substrate was polished using the prototype polishing pad developed in this research. The results indicated 30% improvement in material removal rate compared to the ready-made pad. サファイアなどの難加工材料基板の高効率研磨を実現するため，摩耗特性の異なる材料を用いたポリシングパッドを開発した．ここではポリシングパッド面に耐摩耗性や強度などの機械的特性が高いナイロン繊維と耐摩耗率の低い材料を配列させて，ドレッシングを行うことでナイロン繊維部分に突起形状を形成する．ここでナイロン繊維の配向性や配列を制御できれば，パッド表面にマイクロ突起形状が得られ，安定した研磨性能が期待できる．本研究では本手法で開発されたパッドを形状発現型パッドとし，試作品を用いてサファイア基板をポリシングした．その結果，汎用品パッドのSUBA600より30％程度の材料除去レートの向上が得られたので報告する．
ISSN:0914-2703
1880-7534
DOI:10.11420/jsat.62.264