Cross-sectional Observation of Ni-P/Cu Multilayer Films and their Dependence of Wear Resistance with Ni-P/Cu Thickness

Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films dec...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 64; no. 11; pp. 605 - 607
Main Authors IZAWA, Keisuke, KANEKO, Shingo, MOCHIDA, Yoshiyuki, SARAVANAN, Govindachetty, JEEVAGAN, Arockiam John, KOBAYASHI, Genki, SATO, Yuichi, MATSUMOTO, Futoshi
Format Journal Article
LanguageJapanese
Published The Surface Finishing Society of Japan 01.11.2013
Subjects
Copper
Cross sections
CU
Electro-deposition
Electrodeposition
INTERLAYERS
Multilayers
NI
Ni-P Layer Ratio
Ni-P/Cu Deposition Period
Ni-P/Cu Multilayer
Nickel
SOLVENTS
Wear
WEAR MECHANISMS
Wear Resistance
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Summary:Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films decreased concomitantly with increasing Ni-P layer ratio in the Ni-P/Cu bilayer.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
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ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.64.605