Numerical Analysis of Residual Stress in Resin-Molded Products : 1st Report, Visco-Elastic Analysis of Stress and Deformation caused by Cooling after the Curing Process
A computer program to analyze residual stress and deformation, which occur by cooling after the curing process of resin-molded products, is developed. Visco-elastic behavior of the resin is simulated in this program. This program enables simple analysis of the molded body of a complicated three-dime...
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Published in | Transactions of the Japan Society of Mechanical Engineers Series A Vol. 64; no. 622; pp. 1660 - 1666 |
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Main Authors | , , , |
Format | Journal Article |
Language | Japanese |
Published |
The Japan Society of Mechanical Engineers
25.06.1998
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Subjects | |
Online Access | Get full text |
ISSN | 0387-5008 1884-8338 |
DOI | 10.1299/kikaia.64.1660 |
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