Numerical Analysis of Residual Stress in Resin-Molded Products : 1st Report, Visco-Elastic Analysis of Stress and Deformation caused by Cooling after the Curing Process

A computer program to analyze residual stress and deformation, which occur by cooling after the curing process of resin-molded products, is developed. Visco-elastic behavior of the resin is simulated in this program. This program enables simple analysis of the molded body of a complicated three-dime...

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Bibliographic Details
Published inTransactions of the Japan Society of Mechanical Engineers Series A Vol. 64; no. 622; pp. 1660 - 1666
Main Authors SAITO, Naoto, HARAGUCHI, Yoshihiro, AMAGI, Shigeo, SASAKI, Koji
Format Journal Article
LanguageJapanese
Published The Japan Society of Mechanical Engineers 25.06.1998
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ISSN0387-5008
1884-8338
DOI10.1299/kikaia.64.1660

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