Numerical Analysis of Residual Stress in Resin-Molded Products : 1st Report, Visco-Elastic Analysis of Stress and Deformation caused by Cooling after the Curing Process

A computer program to analyze residual stress and deformation, which occur by cooling after the curing process of resin-molded products, is developed. Visco-elastic behavior of the resin is simulated in this program. This program enables simple analysis of the molded body of a complicated three-dime...

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Bibliographic Details
Published inTransactions of the Japan Society of Mechanical Engineers Series A Vol. 64; no. 622; pp. 1660 - 1666
Main Authors SASAKI, Koji, SAITO, Naoto, AMAGI, Shigeo, HARAGUCHI, Yoshihiro
Format Journal Article
LanguageJapanese
Published The Japan Society of Mechanical Engineers 25.06.1998
Subjects
Approximation
Computational Mechanics
Effective Stress Function
Finite Element Method
High Polymer Materials
Relaxation Modulus
Residual Stress
Visco Elasticity
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Summary:A computer program to analyze residual stress and deformation, which occur by cooling after the curing process of resin-molded products, is developed. Visco-elastic behavior of the resin is simulated in this program. This program enables simple analysis of the molded body of a complicated three-dimensional shape because (1) it uses approximation with exponential function of the relaxation modulus, (2) it applies this approximation to the creep finite-element method, (3) it uses the effective stress function method. Comparative experiments, using test pieces of molded metals to confirm the performance of this program, showed that the deformation of the test pieces during cooling after curing agreed well with the calculated results.
ISSN:0387-5008
1884-8338
DOI:10.1299/kikaia.64.1660