The enhancement of displacement of shear piezoelectric stack actuator with conductive adhesive

• Published in: International Conference on Advanced Mechatronic Systems pp. 72 - 76
• Main Authors: Kang, Huazhou, Yang, Yixiao, Wang, Quan, Yang, Xiaofeng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 26.11.2024
• Subjects: Actuators; adhesive; Bonding; bonding layer; conductive adhesive; Conductive adhesives; Dielectrics; Energy loss; Manufacturing; Mechatronics; Motors; shear piezoelectric stack actuator; Voltage
• ISSN: 2325-0690
• DOI: 10.1109/ICAMechS63130.2024.10818822

The shear piezoelectric stack actuator operates under d 15 mode with shear output, offering a vertical displacement with the voltage output. Restricted by the manufacturing of shear stacks, the bonding layer with adhesive has the ability of dielectrics, which has an energy loss and makes the input electric less than the desired value. The dielectric from the bonding adhesive would reduce the displacement output of the actuator. To enhance the displacement, in this paper, we alter the regular dielectric adhesive into conductive adhesive by adding metal-coated fillers inside. Results show that the actuator's displacement with the conductive adhesive is 19% higher than that of the stack with regular dielectric adhesive with 3.5% fillers. The displacement enhancement indicates that the replacement of conductive adhesive will have a future application in the design of the piezoelectric-base motor.