Power-efficient high-frequency integrated circuits and communication systems developed within Cool Silicon cluster project

An overview about research activities in the field of high frequency integrated circuits and communication systems performed within the German cluster project Cool Silicon is given. Cool Silicon is located around Dresden/Silicon Saxony/Germany and features around 50 projects and 100 partners from in...

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Published in2013 SBMO/IEEE MTT-S International Microwave & Optoelectronics Conference (IMOC) pp. 1 - 2
Main Authors Ellinger, F., Fettweis, G., Tzschoppe, C., Carta, C., Fritsche, D., Tretter, G., Yodprasit, U., Paulo, R., Richter, A., Strobel, A., Wolf, R., Fehske, A., Isheden, C., Pawlak, A., Schroter, M., Schumann, S., Hoppner, S., Walter, D., Eisenreich, H., Schuffny, R.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2013
Subjects
3G mobile communication
Belts
BiCMOS integrated circuits
CMOS integrated circuits
CMOS technology
Frequency modulation
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Summary:An overview about research activities in the field of high frequency integrated circuits and communication systems performed within the German cluster project Cool Silicon is given. Cool Silicon is located around Dresden/Silicon Saxony/Germany and features around 50 projects and 100 partners from industry and research institutions, and aims at significantly increasing the energy efficiency of information and communications technologies.
DOI:10.1109/IMOC.2013.6646416