Hybrid EM/circuit modeling for carbon nanotubes based interconnects

In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is deri...

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Bibliographic Details
Published in2011 IEEE 13th Electronics Packaging Technology Conference pp. 158 - 162
Main Authors Brun, C., Franck, P., Yap Chin Chong, Dunlin Tan, Tong, E. T. H., Bila, S., Baillargeat, D., Beng Kang Tay
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2011
Subjects
Capacitance
Carbon nanotubes
Couplings
Electromagnetics
Integrated circuit interconnections
Integrated circuit modeling
Solid modeling
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Summary:In this paper, carbon nanotube models for high-frequency interconnect applications are studied applying electromagnetic and circuit approaches. A first validation of both models gives a better understanding of carbon nanotubes behaviors in RF. The complex surface impedance used in this paper is derived from Hanson's conductivity in order to take in consideration the quantum capacitance and all other components existing in nano-scale world. A study of CNT inter-coupling is then possible within a transmission line configuration above a ground plane. In future devices, nano-interconnect based on CNTs will be gathered within bundles, a better comprehension of coupling inside and around this bundle allows developing complex CNT bundle models. A RF device approach using CNT bundle models is brought at the end of this paper.
ISBN:9781457719837
1457719835
DOI:10.1109/EPTC.2011.6184406