Transfer Printing for Silicon Photonics Transceivers and Interposers

We present transfer printing as an enabling technology to realize heterogeneous photonic integrated circuits. The approach enables a cost-effective and intimate integration of III-V lasers on advanced high-speed Si PICs. It also enables the integration of III-V and silicon-based opto-electronic comp...

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Bibliographic Details
Published in2018 IEEE Optical Interconnects Conference (OI) pp. 13 - 14
Main Authors Roelkens, G., Zhang, J., De Groote, A., Juvert, J., Ye, N., Kumari, S., Goyvaerts, J., Muliuk, G., Uvin, S., Chen, G., Haq, B., Snyder, B., Van Campenhout, J., Van Thourhout, D., Trindade, A. J., Bower, C.A., O'Callaghan, J., Loi, R., Roycroft, B., Corbett, B.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.06.2018
Subjects
Flip-chip devices
III-V semiconductor materials
Optical waveguides
Photonics
Printing
Silicon
Waveguide lasers
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Summary:We present transfer printing as an enabling technology to realize heterogeneous photonic integrated circuits. The approach enables a cost-effective and intimate integration of III-V lasers on advanced high-speed Si PICs. It also enables the integration of III-V and silicon-based opto-electronic components on a passive Si/SiN interposer.
DOI:10.1109/OIC.2018.8422030