A comparison of processes and challenges between organic, a-Si:H, and oxide TFTs for active matrix backplanes on plastic
Processes to produce active-matrix backplanes on plastic substrates have been developed utilizing a-Si:H, multi-component oxide, and organic semiconductor technologies. The suitability of these technologies for future flat panel display applications is discussed. Of these material systems multi-comp...
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Published in | 2012 19th International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) pp. 57 - 60 |
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Main Authors | , , , , , , , , , , , , , , , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.07.2012
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Subjects | |
Online Access | Get full text |
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Summary: | Processes to produce active-matrix backplanes on plastic substrates have been developed utilizing a-Si:H, multi-component oxide, and organic semiconductor technologies. The suitability of these technologies for future flat panel display applications is discussed. Of these material systems multi-component oxides exhibit highest field-effect mobilities (10cm 2 /Vs for zinc tin oxide demonstrated), followed by small molecule organic semiconductors (0.95 cm 2 /Vs), and a-Si:H (0.5 cm 2 /Vs). Yet despite higher mobilities, organic TFTs drive less current than a-Si:H because of the low device capacitances required to fabricate such devices. Backplanes made with a-Si:H appear to be the least risky technology, followed by multi-component oxide, and organic semiconductor technologies. |
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ISBN: | 9781467303996 1467303992 |