Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C

Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature...

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Bibliographic Details
Published in2017 IEEE CPMT Symposium Japan (ICSJ) pp. 149 - 152
Main Authors Sakamoto, Mamoru, Nakadozono, Kenichi, Iwanabe, Keiichiro, Asano, Tanemasa
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.11.2017
Subjects
Acoustics
Bonding
Cu wire
in-situ strain measurement
piezoresistance gauge
Strain
Strain measurement
Substrates
Temperature measurement
ultrasonic bonding
under pad damage
wire bonding
Wires
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Summary:Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature significantly enhanced deformation of the Cu FAB while the application of pressing load and ultrasonic vibration. Visualization of the average strain clearly indicated that concentration of strain in the device layer at the positon over which the end of capillary was present was reduced. Therefore, elevating substrate temperature may reduce generation of damage in the device layer. It was also found that elevating substrate temperature reduced the residual strain in the device layer.
ISSN:2475-8418
DOI:10.1109/ICSJ.2017.8240137