Molecularly derived mesoscale modeling of an epoxy/Cu interface (part III): Interface roughness

This paper addresses use of coarse-grained mesoscale model to look at angle dependencies in an epoxy-copper (I) oxide interface in order to understand roughness effects on adhesion. The parameterization of the coarse-grained beads were previously parameterized from the molecular level [1-3] for the...

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Bibliographic Details
Published in2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems pp. 1/8 - 8/8
Main Author Iwamoto, Nancy
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.04.2012
Subjects
Delamination
Polymers
Strain
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Summary:This paper addresses use of coarse-grained mesoscale model to look at angle dependencies in an epoxy-copper (I) oxide interface in order to understand roughness effects on adhesion. The parameterization of the coarse-grained beads were previously parameterized from the molecular level [1-3] for the same polymer and copper oxide interface. Roughness was investigated in two ways: applying a zigzag interface to the interface separation simulation, and separating the interface using differing angles. When compared, both methods reduce to the similar energy trends. In addition, the effect moisture on the interface was compared for the rough and smooth interfaces.
ISBN:1467315125
9781467315128
DOI:10.1109/ESimE.2012.6191702