Design and implementation of a LTCC-based receiver front-end module

A S-band receiver front-end module using Low Temperature Co-fired Ceramic technology is presented to be small and reliable with the main passive components such as splitter, coupler, bandpass filter, resistors and capacitors embedded in LTCC substrates. The MCM-level module with a dimension of 27mm×...

Full description

Saved in:
Bibliographic Details
Published in2010 International Conference on Microwave and Millimeter Wave Technology pp. 1053 - 1056
Main Authors Li Zhong-yun, Zeng Geng-hua, Chen Peng, Yang Jian-yu
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.05.2010
Subjects
Assembly systems
Band pass filters
Capacitors
Design engineering
Microwave circuits
Nonhomogeneous media
Radar antennas
Reliability engineering
Resistors
Signal design
Online AccessGet full text

Cover

More Information
Summary:A S-band receiver front-end module using Low Temperature Co-fired Ceramic technology is presented to be small and reliable with the main passive components such as splitter, coupler, bandpass filter, resistors and capacitors embedded in LTCC substrates. The MCM-level module with a dimension of 27mm×25mm×1.9mm, realized in interconnecting the active chips by micro-assembly technology, is shown to meet the requirements quite well in experimental test.
ISBN:9781424457052
142445705X
DOI:10.1109/ICMMT.2010.5525100