Low Temperature non-viscous adhesive bonding in MEMS

• Published in: 2006 29th International Spring Seminar on Electronics Technology pp. 44 - 48
• Main Authors: Andrijasevic, D., Malecki, K., Gioroudi, I., Smetana, W., Brenner, W.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2006
• Subjects: Assembly systems; Bonding processes; Micromechanical devices; Numerical simulation; Packaging; Softening; Solids; System testing; Temperature; Voltage
• ISBN: 9781424405503; 1424405505
• ISSN: 2161-2528
• DOI: 10.1109/ISSE.2006.365357

This paper discusses various aspects of the design, the realisation and the testing of an bonding technique for assembly of micro(optoelectronic) systems. The proposed concept of non-viscous adhesives micro bonding overcomes the main disadvantages of the traditional MEMS bonding processes like requirements for high voltage, high temperature, high quality of surfaces, etc. Experiments were performed with different solid adhesives with low softening point (65degC and 72degC), while process parameters: softening time, softening temperature and working distance were varied. Suitable process parameters were finally identified and established. In parallel, adequate numerical simulations in programme package ANSYStrade were done in order to accelerate the procedure of process parameter optimisation. Obtained experimental results are in good agreement with those gained by simulations. The main advantages of this technique are: low processing temperature, applicability for different material combinations, partial reversibility, and partial biocompatibility. Additionally, this technological system is very compact, it can be easily integrated into existing production lines, and it seems to be cost efficient solution.