Throughput improvement with setup reduction focusing on process identification

We improved throughput by reducing operational loss that occurs owing to the process condition change in semiconductor manufacturing equipments. As a result of Equipment Engineering System (EES) data analysis, we found that it took time from several to ten percent of Raw Processing Time to adjust et...

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Bibliographic Details
Published in2008 International Symposium on Semiconductor Manufacturing (ISSM) pp. 107 - 110
Main Authors Kobayashi, Yoshiaki, Hayamizu, Taichi, Sakai, Katsuhisa
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.10.2008
Subjects
Dispatching
Etching
Manufacturing
Process control
Productivity
Temperature measurement
Throughput
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Summary:We improved throughput by reducing operational loss that occurs owing to the process condition change in semiconductor manufacturing equipments. As a result of Equipment Engineering System (EES) data analysis, we found that it took time from several to ten percent of Raw Processing Time to adjust etchers Electrostatic Chuck (ESC) temperature. Controlling ESC temperature of each recipe based on process flow and process information, and processing the same ESC temperature process consecutively for a certain period have resulted in throughput improvement in etching process by up to 7 percent and by 4 percent on average.
ISSN:1523-553X